This talk will give an overview of Tyndall’s capabilities in developing advanced photonic and electronic sub-systems and how these are integrated to produce fully functioning prototypes. The talk will also present Tyndall’s capabilities to enable scale-up from prototypes to pilot scale manufacturing and the drive to develop packaging standards. The talk will also discuss new research activities to develop a more scalable packaging technology for mass markets, taking lessons from the electronics industry to build a new global standard in photonic packaging.

Prof. Peter O’Brien is head of the Photonics Packaging & Systems Integration Group at the Tyndall Institute, University College Cork in Ireland. He is also Director of the PIXAPP European Packaging Pilot Line (www.pixapp.eu), Director of the new European Photonics Innovation Academy and Deputy Director of the Science Foundation Ireland Photonics Centre, IPIC. He previously founded and sold a photonics start-up company and was a researcher in millimeter wave devices at Caltech and NASA’s Jet Propulsion Laboratory.